Innovation Technology Award | Changguang Huaxin 850nm 100G PAM4 VCSEL Chip

12/10

2024

On December 6th, the 2024 ICC Xunshi Optical Communication Industry Heroes Awards Ceremony was held in Suzhou, Changguang Huaxin's 850nm 100G PAM4 VCSEL chip won the Innovation Technology Award!

The ICC Xunshi Optical Communication Industry Heroes List selects award-winning products based on the optical communication industry chain, considering data such as the technology, cost, market share, customer satisfaction, and third-party authoritative verification of the participating products, After eleven years of development, the Xunshi Heroes List has become one of the top annual selection events in the optical communication industry. The Innovation Technology Award aims to recognize products in 2024 that have significant importance in addressing shortcomings, filling gaps, or achieving domestic substitution.

850nm 100G PAM4 VCSEL chip

The awarded 850nm 100G PAM4 VCSEL chip product matches the industry's top level in key characteristics such as bandwidth and RIN. ：

1) Typical bandwidth at room temperature is 28GHz, typical RIN value < -150dB/Hz;

2) Wavelength < 863nm, meeting the IEEE 100m OM4 multimode fiber transmission standard requirements;

3) Excellent anti-reflection performance ensures that customer modules operate with no BER jumps across the full temperature range of 0-70℃;

The chip meets 400G VR4/SR4/AOC, 800G VR8/SR8/AOC applications, and the product has completed reliability certification strictly according to the GR468 standard.

The wafer product has been verified to perform excellently at customer sites, meeting 100m OM4 transmission, with high yield, representing the high performance and high quality level of domestic chips in the industry.

One-stop IDM full-process technology platform

After more than ten years of development, Changguang Huaxin has established a complete one-stop IDM full-process platform covering chip design, MOCVD (epitaxy), photolithography, cleaving/coating, packaging, and testing. In the development of high-speed optical communication chips, it has overcome key technologies such as secondary epitaxy docking processes, epitaxial growth containing AL materials, special anti-reflection design, and cavity surface passivation coating. The development of 100G VCSEL products and mass production are independently controllable, with significant advantages in production capacity and quality control compared to the foundry model in terms of mass production stability and reliability.

One-stop IDM solution provider for short-distance interconnect optical chips

Changguang Huaxin has formed a comprehensive and rich communication optical chip product matrix, capable of meeting ultra-large capacity data communication needs, covering VR, SR, DR, FR in distance, and covering single wavelength 25G, 50G, 100G in rate. It can quickly solve the shortage of high-end optical chip capacity and cost pain points, and is a one-stop IDM solution provider for short-distance interconnect optical chips!

Rich semiconductor laser chip platform

Changguang Huaxin focuses on the research and production of semiconductor laser chips, with core technologies covering the most critical areas of the semiconductor laser industry. It has overcome long-standing technical challenges in epitaxial growth, cavity surface treatment, packaging, and fiber coupling, and has built a fully independently controllable complete process platform and production line from chip design, MOCVD (epitaxy), FAB wafer fabrication, cleaving/coating, packaging, testing, optical coupling, to direct semiconductor lasers, with three major production lines of 2-inch, 3-inch, and 6-inch wafers, two major product structures of edge-emitting EEL and surface-emitting VCSEL, and three major material systems of GaAs (Gallium Arsenide), InP (Indium Phosphide), and GaN (Gallium Nitride). ， It is one of the few IDM semiconductor laser companies globally with key process production capabilities such as 6-inch line epitaxy and wafer manufacturing. Looking to the future, we are actively developing and evolving next-generation optical chip platform technologies and products.

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