Laser Device

Everbright adopts self-developed laser chips and prepares diode laser devices with low stress, high thermal conductivity and no welding voids through highly reliable packaging technology, which ensures excellent chip power, brightness and efficiency index and significantly improves device reliability and lifetime level.

Fiber Coupled Module

Everbright has developed a fully automated production line for high power semiconductor laser diode fiber coupling module Active Alignment, covering all processes from fast axis collimated lens assembly to fiber coupling, which can quickly produce high power, multi-band fiber coupling modules for various fields such as industry, scientific research and medical treatment to meet customer needs.

Stack

Everbright indium-free hard solder package micro-channel water-cooled array, stable performance, high reliability, long lifetime; hard solder package macro-channel array, back heat dissipation array, using special water channel or conduction cooling design to reduce the requirements for water quality, life expectancy of 20 million pulses or more.

Direct Diode Laser

Everbright is committed to the key technology of direct diode lasers, independent development and localization of key devices, covering beam shaping, high-energy combined beam coupling, suppression extension to thermal management and systems, including four majorproducts ofHundred watts, medium power, high power andQCW.