Illuminating the World, Connecting the Future | Successful Launch of Changguang Huaxin Optical Communication New Product Conference

09/20

2024

On September 11, the 25th CIOE China International Optoelectronic Expo grandly opened at the Shenzhen International Convention and Exhibition Center. Changguang Huaxin simultaneously exhibited in the laser and communication pavilions. In Hall 4, Laser Pavilion 4A070, it showcased a full range of products including high-power semiconductor laser chips, devices, pump source modules, direct semiconductor systems, LiDAR and 3D sensing chips; in Hall 12, Communication Pavilion 12C61, it exhibited a series of high-speed communication optical chips.

At 10 a.m., the "Optical Communication World, Core System Future" Changguang Huaxin Optical Communication New Product Launch was held at booth 12C61. Changguang Huaxin Deputy General Manager Wu Zhenlin released the heavyweight new products: 100G PAM4 VCSEL and matching PD, iteratively upgraded 70mW DFB and 100mW DFB silicon photonic light source products, and the "One-stop IDM Solution for Short-distance Interconnect Optical Chips."

At the launch event

The launch event was simultaneously live-streamed on Changguang Huaxin's official platforms including WeChat Video Channel, Douyin, Bilibili, as well as professional media platforms such as Fiber Online, Xunshi Optical Communications, and Vico Network Optical Communications, attracting widespread attention from industry insiders and outsiders.

Changguang Huaxin Deputy General Manager Wu Zhenlin presenting new products on site

The boom of intelligent computing AI has brought massive demand for high-end optical modules, thus imposing higher requirements on the high performance, high reliability, and iteration speed of underlying optical chips. Currently, high-end communication optical chips are still dominated by leading overseas players, and the domestic shortage or even absence of "one chip hard to find" remains an industry pain point.

Based on a compound semiconductor full-process IDM platform, Changguang Huaxin has built five major platform capabilities: design, epitaxy, process, packaging and testing, and reliability. Over the years, it has continuously invested in keeping pace with the development of the optical communication industry, insisted on introducing top global industry experts and cultivating high-end talents independently, and has successively overcome multiple high-end optical chip products and built sufficient mass production capacity, progressing from learning, catching up, to matching the industry's top level.

Changguang Huaxin adheres to the development strategy of "one platform, one fulcrum, horizontal expansion, vertical extension," deeply cultivating the III-V group optical chip field, and is committed to becoming a "one-stop IDM solution provider for short-distance interconnect optical chips" in the optical communication field, providing source solutions for the increasingly intense competition in rate and computing power, and helping to solve the current industry's various optical chip supply shortages.

Facing the explosive growth market demand and the industry pain point of high-end optical chip shortages, the newly released 100G PAM4 VCSEL and matching PD optical chip products, the iteratively upgraded 70mW DFB and 100mW DFB products, and the full series of multi-product combinations exhibited by Changguang Huaxin realize comprehensive coverage of 0~2km, single-wavelength 100Gbps short-distance interconnect optical module optical chip solutions. Among them, the performance consistency and reliability of multiple products have been highly praised in early verification and mass production by multiple customers.

100G PAM4 VCSEL New Product Launch

The newly released 100G PAM4 VCSEL/PD meets the applications of 400G VR4/SR4/AOC, 800G VR8/SR8/AOC, and matches the industry's top level in key characteristics such as bandwidth and RIN. The products have strictly completed reliability certification according to the GR468 standard.

The wafer products have shown excellent performance in customer verification, meeting 100m OM4 transmission with high yield, representing the high performance and high quality level of domestic chips in the industry.

DFB Light Source Iterative Upgrade Products

The iteratively upgraded DFB silicon photonic light source products by Changguang Huaxin are used for 400G DR4/800G DR8/1.6T DR8.

Both DFB products have higher WPE, allowing customers to obtain higher optical power with smaller current, helping customers reduce module power consumption while having more sufficient power budget and improving coupling production efficiency.

Mainly applied to O-band silicon photonic data center optical modules, combined with COB packaging technology, no cooling, and single light source characteristics, these high-speed silicon photonic optical modules have significant cost advantages, can meet the demand for silicon photonic modules such as 400G DR4, are compatible with future 800G/1.6T optical interconnect applications, and meet the demands of continuous high-speed evolution.

Changguang Huaxin

— One-stop IDM Solution Provider for Short-distance Interconnect Optical Chips

Changguang Huaxin has formed a comprehensive and rich communication optical chip product matrix, capable of meeting ultra-large capacity data communication needs, covering distances such as VR, SR, DR, FR, and rates covering single-wavelength 25G, 50G, 100G.

At this CIOE exhibition, a full series of five major product matrices were displayed: EML, DFB, VCSEL, PIN, and APD:

■ Uncooled 100G PAM4 EML for 100G DR/FR, 400G DR4/FR4, 800G DR8/2*FR4;

■ 70mW and 100mW DFB chips for 400G DR4, 800G DR8, 1.6T DR8, which can be used as light sources for silicon photonic modulators;

■ 50G PAM4 VCSEL/PD for 200G SR4, 400G SR8;

■ 100G PAM4 VCSEL/PD for 400G VR4/SR4, 800G VR4/SR4.

The short-distance interconnect solution series of optical chip products released and exhibited this time have all achieved mass production, quickly solving the high-end optical chip capacity shortage and cost pain points, providing industry customers with one-stop IDM solutions!

Looking to the future, we are actively developing and evolving next-generation optical chip platform technologies and products.

Welcome everyone to visit and communicate at booth 12C61 in Hall 12!

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