Everbright's Advanced Compound Semiconductor Photonics Platform Officially Topped Out!
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- Time of issue:2024-09-23
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(Summary description)On September 20, 2024, the Everbright Advanced Compound Semiconductor Photonics Platform project was officially topped out. The ceremony was attended by Ming Dayong, Chairman and General Manager of Everbright, along with other company executives and representatives from Zhongshe Construction Group.
Everbright's Advanced Compound Semiconductor Photonics Platform Officially Topped Out!
(Summary description)On September 20, 2024, the Everbright Advanced Compound Semiconductor Photonics Platform project was officially topped out. The ceremony was attended by Ming Dayong, Chairman and General Manager of Everbright, along with other company executives and representatives from Zhongshe Construction Group.
- Categories:News
- Author:
- Origin:
- Time of issue:2024-09-23
- Views:0
On September 20, 2024, the Everbright Advanced Compound Semiconductor Photonics Platform project was officially topped out. The ceremony was attended by Ming Dayong, Chairman and General Manager of Everbright, along with other company executives and representatives from Zhongshe Construction Group.
The construction project for the advanced compound semiconductor photonics platform spans approximately 31 acres, including a production center, R&D center, power station, and supporting facilities. It is aimed at establishing a top-tier domestic semiconductor laser chip R&D and manufacturing platform, benchmarked against international top standards, to develop an advanced device R&D and industrialization platform focusing on materials, processes, and packaging technologies for various compound semiconductors-based optoelectronic and electronic devices. This project is another significant milestone following Everbright 's relocation to a new base on August 8, 2022, and it aligns with the company's strategic development plan of "one platform, one fulcrum, horizontal expansion, and vertical extension." The project has been listed as a key engineering project in Jiangsu Province.
Construction began in 2023, and the full completion and commissioning are expected in 2025.
The topping out of this project marks a new level of capacity, R&D capabilities, and both horizontal and vertical expansion for Everbright in terms of a variety of compound semiconductor photonic chips and devices. Horizontally, it covers visible, near-infrared, mid-wave, long-wave multi-band laser chips, and silicon photonic integrated chips; vertically, it extends from laser displays, industrial lasers, optical communications, and laser sensing to life sciences and health, covering mainstream applications and future industries.
Building upon its current leading 6-inch compound semiconductor production line, the project will advance R&D hardware and R&D production levels to fully reach international standards. It aims to create a new generation of China's indigenous laser industry ecosystem, fostering innovation collaboration among government, capital, industry, region, research institutes, enterprises, and upstream and downstream supply chains, thereby promoting technological innovation in China's laser industry.
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