Hot Release | Everbright Introduces 200 MW Uncooled CW DFB Optical Communication Chip With High Power And Low Power Consumption!
09/28
2025
01. | Changes in the Optical Module Market Pose Challenges for Optical Chips
In recent years, the demand for AI has grown exponentially, driving a rapid increase in global inference computing requirements. This trend has prompted cloud service providers to continuously increase investment and accelerate the construction of intelligent computing centers. At the same time, it has driven optical module technology toward higher data rates, with the optical module market undergoing an upgrade from 400G to 800G and 1.6T.
AI optics at Google Source:LightCounting
This technological transformation imposes higher requirements on upstream optical communication chips:
Performance: Transmission rate and energy efficiency need to be improved.
Technology: Breakthroughs are required to overcome high-density integration bottlenecks.
Reliability: Chips must meet the stringent operating conditions of data centers.
02. | In response to the technological shift, Everbright introduces the 200 mW Uncooled CW DFB Chip
In response to evolving technology demands, Everbright has fast-tracked the development of next-generation high-power, energy-efficient DFB chips. On September 10, the opening day of CIOE 2025, the company held a grand product launch at Booth 12C61 in the Optical Communication Expo, officially unveiling its latest 200 mW Uncooled CW DFB optical communication chip.
Photos from the launch event
The newly launched 200 mW Uncooled CW DFB optical communication chip features:
Higher output power: Full-temperature optical power exceeds 200 mW
Lower power consumption: Electro-optical conversion efficiency > 20% at 80 °C
Excellent temperature stability: Supports wide operating temperature from 5 °C to 80 °C
Reliability compliance: Meets non-hermetic operation and Telcordia GR-468-CORE standards
200mW Uncooled CW DFB Optical Communication Chip
This achievement will directly support the silicon photonics integration requirements of 800G/1.6T optical modules, providing a key optical interconnect solution for AI computing infrastructure.
Next-generation LPO/CPO technologies have emerged as the mainstream trend in optical communication, driving laser chips toward higher power, lower noise, and greater integration. Against this backdrop, the 200–400 mW CW DFB light source, with its advantages in energy efficiency and cost, is becoming a core incremental device in high-speed optical interconnects, thanks to its compatibility with 800G/1.6T modules and strong potential for mass production.
03. | One-stop IDM Solution Provider for Short-distance Interconnect Optical Chips
Everbright adheres to the development strategy of "One Platform, One Fulcrum, Horizontal Expansion, and Vertical Extension." Leveraging its end-to-end compound semiconductor IDM platform, the company has established five core capabilities in design, epitaxy, process, packaging & testing, and reliability, laying a solid foundation for continuous innovation and large-scale applications of laser chips.
Everbright's Full-Chain IDM Platform and Manufacturing Lines
In the field of optical communication, Everbright is committed to becoming a one-stop IDM solution provider for short-reach interconnect optical chips, delivering upstream solutions to address the intensifying competition in data rates and computing power, and helping to alleviate the current shortages in optical chip supply.
The company has established a comprehensive product matrix covering VCSEL, PIN, DFB, and EML diode laser chips, capable of meeting the demands of ultra-high-capacity data communications.
Four-Category Product Matrix
Everbright will leverage the advantages of its IDM platform to stay at the forefront of optical communication technology, continuously developing higher-power laser light source products-stay tuned!
The CIOE Expo is ongoing. You are warmly invited to visit us at Booth 12C61 (Optical Communication Expo) and Booth 4A071 (Laser Technology Expo) to exchange ideas and explore our latest innovations. We look forward to welcoming you!
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